Investigating the Aging Effects on the Cu, Ni and Au Intermetallic in High Temperature Solders
Presentation Materials | 09 Apr 2024 | Contributor(s):: Nathaniel E Weddington, Carol A Handwerker (editor), John Blendell (editor)
This presentation focuses on investigating aging effects on the Cu, Ni, and Au intermetallic in high-temperature solders. The process in which the solder joint samples are created involves the process of melting, solidification, and aging of the sample. The main topic of this presentation...