Investigating the Aging Effects on the Cu, Ni and Au Intermetallic in High Temperature Solders

By Nathaniel E Weddington1; Carol A Handwerker (editor)1; John Blendell (editor)1

1. Purdue University, West Lafayette, IN

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Abstract

This presentation focuses on investigating aging effects on the Cu, Ni, and Au intermetallic in high-temperature solders. The process in which the solder joint samples are created involves the process of melting, solidification, and aging of the sample. The main topic of this presentation will be focused on the solid-solid diffusion that occurs in the aging process. The diffusion of metals creates an intermetallic layer in the solder joint with various compositions such as (Cu6Sn5, Ni3Sn4, and AuSn2) depending on the solder board and the surface finish. The purpose of looking into this diffusion process is to understand the solubility depth into the specimen and the formation and growth of the intermetallic layer.

Credits

Graduate Student: Lijia Xie

PI's: Professor Handwerker and Professor Blendell

Sponsored by

SCALE Heterogenous Integration /Advanced Packaging

Cite this work

Researchers should cite this work as follows:

  • Nathaniel E Weddington, Carol A Handwerker, John Blendell (2024), "Investigating the Aging Effects on the Cu, Ni and Au Intermetallic in High Temperature Solders," https://nanohub.org/resources/38803.

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Tags

  1. materials science
  2. SCALE@Purdue
  3. SCALE (Scalable Asymmetric Lifecycle Engagement)