Investigating the Aging Effects on the Cu, Ni and Au Intermetallic in High Temperature Solders
Presentation Materials | 09 Apr 2024 | Contributor(s): Nathaniel E Weddington, Carol A Handwerker (editor), John Blendell (editor)
This presentation focuses on investigating aging effects on the Cu, Ni, and Au intermetallic in high-temperature solders. The process in which the solder joint samples are created involves the process of melting, solidification, and aging of the sample. The main topic of this presentation...
AFM And EBSD Cross-Comparison Analysis Tool
Presentation Materials | 14 Aug 2018 | Contributor(s): Andrew Martin Krawec, John Blendell, Matthew John Michie
Ceramic and semiconductor research is limited in its ability to create holistic representations of data in concise, easily-accessible file formats or visual data representations. These materials are used in everyday electronics, and optimizing their electrical and physical properties is...
Surface Evolver GUI
Tools | 12 Oct 2018 | Contributor(s): Kevin K Ngo, Lucas Darby Robinson, John Blendell, R. Edwin Garcia
A GUI for the Surface Evolver to simulate polycrystalline grain growth in thin films.
The Wright Flyer Crankcase: Precipitation Hardening in the First Aerospace Aluminum Alloys
Online Presentations | 11 Jul 2013 | Contributor(s): John Blendell
Equilibrium Wulff Shape Generator
Tools | 19 Jun 2012 | Contributor(s): R. Edwin García, John Blendell
Wulff Shape Generator
Top 5 shown