SCALE Technical Certification Framework for Heterogeneous Integration and Advanced Packaging
Papers | 13 May 2024 | Contributor(s): Eric A Holloway, Jennifer S. Linvill, Madeleine Yang, Carol A Handwerker
With the growing demand for a robust microelectronics workforce, the U.S. Defense Industrial Base (DIB) is faced with a current shortage of qualified workers [1-3]. As workforce development programs grow and expand in the engineering education space, there is a need to ensure that students are...
Investigating the Aging Effects on the Cu, Ni and Au Intermetallic in High Temperature Solders
Presentation Materials | 09 Apr 2024 | Contributor(s): Nathaniel E Weddington, Carol A Handwerker (editor), John Blendell (editor)
This presentation focuses on investigating aging effects on the Cu, Ni, and Au intermetallic in high-temperature solders. The process in which the solder joint samples are created involves the process of melting, solidification, and aging of the sample. The main topic of this presentation...
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