Illinois ECE 598EP Lecture 1 - Hot Chips: Atoms to Heat Sinks
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Abstract
Introduction
Content:
- The Big Picture
- Another CPU without a Heat Sink
- Thermal Management Methods
- Impact on People and Environment
- Packaging cost
- IBM S/390 refrigeration and processor packaging
- Intel Itanium and Pentium 4packaging
- Graphics Cards
- Under/Overclocking
- Environment
- A More Detailed Look
- Thermal Management Methods
- Where Does the Heat Come From?
- More on Chip-Level Complexity
- Temporal, Spatial Variations
- Variations Depending on Application
- Temperature Affects
- Thermal Interconnect Failure
- Chip-Level Thermal Challenges
- Why (down)Scaling?
- CMOS Power Issue: Active vs. Passive
- Power and Heat Limit Frequency Scaling
- Has This Ever Happened Before?
- Implications for Nanoscale Circuits
- Transistor-Level Thermal Challenges
- The Tiny Picture
- K of Nano, RB of Interfaces
- Thermal Resistance at Device Level
- Thermal Resistance, Electrical Resistance
- This Heating Business is Not All Bad…
- Nanotubes in the Carbon World
- Why Carbon Nanotubes and Graphene?
- Light Emission from Metallic SWNTs
- Extracting SWNT Thermal Conductivity
- What Is Phase-Change Memory?
- How Phase-Change Materials Works
- Samsung 512 Mb PCM Prototype
- Intel/ST Phase-Change Memory Wafer
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Breezed and uploaded by Omar Sobh
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