Cold Atmospheric Plasma Chemical Vapor Deposition of Silica

By Samuel Josiah Hyde1; Rahim Rahimi1; Venkat Kasi1

1. Purdue University, West Lafayette, IN

Published on

Abstract

CVD has become a significant process particularly for its use in electronics.  We use cold atmospheric plasma to deposit silica in a much more scalable manner.  Silica is deposited using CVD for applications in many microelectronic devices, but our process has the potential to greatly reduce the production cost of silica films.

Bio

I am a senior in Materials Science Engineering, and I have been doing research with Professor Rahimi for a year.  I have been working with Venkat during the fall semester of 2023 on CAP CVD.

Credits

Professor Rahim Rahimi, Venkat Kasi

Sponsored by

SCALE

Cite this work

Researchers should cite this work as follows:

  • Samuel Josiah Hyde, Rahim Rahimi, Venkat Kasi (2023), "Cold Atmospheric Plasma Chemical Vapor Deposition of Silica," https://nanohub.org/resources/38318.

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