Two-Photon Lithography Analysis

3D geometric measurements of fabricated structures/features

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Archive Version 1.0
Published on 15 Jan 2021
Latest version: 1.2. All versions

doi:10.21981/AJXT-8688 cite this

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Abstract

To improve the utility and ultimate dissemination of our published TPL software tool, we have been developing a framework for which to incorporate (experimental) process variability in our simulation model in order to obtain insight into the repeatability of the TPL process. Our initial approach uses 3D geometric measurements of fabricated structures/features. The tool will provide:

1.Spatial distributions of geometric features. (a)Height (b)Radius (c)Volume

2.Geometric deviation from the designed shape.

3.Summary of geometric features and errors

Bio

Yuhang Yang and Sixian Jia are Ph.D. students in the Department of Mechanical Science Engineering at University of Illinois at Urbana Champaign. 

Cite this work

Researchers should cite this work as follows:

  • Sixian Jia, Yuhang Yang (2021), "Two-Photon Lithography Analysis," https://nanohub.org/resources/tplvaranlz. (DOI: 10.21981/AJXT-8688).

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