nanoHUB-U: Nanophotonic Modeling, 2nd Edition
Fiber Optic Communications
Introduction to Heterogeneous Integration and Electronics Packaging
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April 2024 SCALE Onboarding Handout
Papers | 03 May 2024 | Contributor(s): Gabriella Maria Schr Torres, Peter Bermel, Thomas Lynn Mckinley, Tanya Faltens, Christopher Allen Sowers
This resource is a set of slides used in the April 2024 SCALE Onboarding session. The slides cover a range of topics relevant to SCALE students: the SCALE Roadmap, Mentoring Structure, Security Levels, and Student Classification. The slides also include information on how to access and use the...
The SCALE Workforce Development Model
Papers | 30 Apr 2024 | Contributor(s): Kerrie Douglas, Tamara J. Moore, Melissa A Dyehouse, Alejandro Strachan, Peter Bermel
The Scalable Asymmetric Lifecycle Engagement (SCALE) microelectronics workforce development program is funded by the United States Department of Defense (DoD) to address the critical shortage of a capable microelectronics workforce.
SCALE Internships (Radiation Hardening)
Online Presentations | 02 Jan 2024 | Contributor(s): Peter Bermel
Peter Bermel (SCALE PI) talks about internship opportunities for SCALE students in Summer 2024.
SCALE Overview
Online Presentations | 18 Oct 2023 | Contributor(s): Peter Bermel
Defense Microelectronics Research: Overview
Online Presentations | 27 Jul 2023 | Contributor(s): Peter Bermel
In this talk, I discuss several example research questions in certain technical areas of microelectronics, including radiation-hardened technologies, heterogeneous integration / advanced packaging, and system-on-chip technologies.
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