Anisotropic Electromigration in Sn-Cu solders
05 May 2023 | Contributor(s): Andrew Minh Pham, Kyle Christian DeLay, Marisol Koslowski
This tool simulates how the microstructure of a Cu-Sn solder evolves during electromigration.
Grain Boundary Motion Analysis
08 Aug 2018 | Contributor(s): Jeremy Seiji Marquardt, Xiaorong Cai, Marisol Koslowski
Grain growth is a mechanism to relax residual stresses in thin films. These grains grow out of the thin film surface and are known as whiskers. These whiskers can cause short circuits, so developing scalable and cost effective solutions would increase the reliability and...
Grain Boundary Mobility
01 Aug 2018 | Contributor(s): Jeremy Seiji Marquardt, Xiaorong Cai, Marisol Koslowski
Graph and visualize grain boundary movements for Tin whiskering
1D finite element analysis ME 323
Tools | 19 Mar 2018 | Contributor(s): Peter Kolis, Marisol Koslowski
Mechanics of Materials using Jupyter Notebooks
Purdue ME 581-Numerical Methods in Engineering Using Jupyter Notebooks
Tools | 06 Sep 2017 | Contributor(s): Marisol Koslowski, Peter Kolis, Meredith Michele Meyer, Akshay Vivek Dandekar, Camilo Alberto Duarte-Cordon
Jupyter notebooks with an introduction to python and examples for Numerical Methods in Engineering.
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Purdue Workshop—Predictive materials modeling and simulations: nano- and micro-mechanics
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Objectives This by-invitation-only workshop will focus on recent progress and current challenges in the area of experimentally validated, predictive modeling of mechanical properties of nano- or micro-engineered materials. Areas of interest include micro- and nano-electromechanical devices...
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