Join us for a hands-on Thermo-Calc workshop! You will learn how industrial soldering practices can be contextualized into current engineering classrooms to provide students with situated learning experiences and how Thermo-Calc can be utilized as an effective self-learning or teaching tool to solve real-world engineering problems relevant to solders.

Title: Integrating microelectronics contexts into engineering classrooms: Thermo-Calc online tool for the design of solder materials
Date: Wednesday, May 11, 2022, 1:30 - 2:30 p.m. EDT
Presenter: Congying Wang, Ph.D., Postdoctoral Associate in the School of Materials Engineering at Purdue University

Abstract: In microelectronics, components are attached to circuit boards with a material that can carry the electrical signals through and form a strong mechanical bond, known as solder. The mechanical properties and joint reliability of solders strongly depend on the physical metallurgy and microstructure. Understanding the behavior of existing solders and developing new ones requires a complete understanding of the system such as solidification, aging, and intermetallic formation.

Phase diagrams are widely used in the electronics industry to determine the presence of intermetallic compounds, the melting point of alloys, and the solubility of elements at different temperatures. Thermo-Calc is an ideal computational tool to obtain such understandings for various solders.

This workshop will first present how industrial soldering practices can be contextualized into current engineering classrooms, especially in materials science, to provide students with situated learning experiences. Then the workshop will demonstrate how Thermo-Calc can be utilized as an effective self-learning or teaching tool to solve real-world engineering problems relevant to solders.

For free access to Thermo-Calc software in nanoHUB, join the Thermo-Calc Educational Version group.

1. materials properties
2. materials science
3. metals
4. thermodynamics