Thermal Transport in Layered Materials, Devices, and Systems

By Eric Pop

Electrical Engineering, Stanford University, Stanford, CA

Published on

Abstract

The Viskanta Lecture

The thermal properties of layered materials (like graphene and MoS2) are an active area of investigation, particularly due to their anisotropic and tunable thermal conductivity. We have studied their behavior as part of transistors [1,2], where self-heating is a major challenge for performance and reliability. For instance, the electron saturation velocity in MoS2 transistors is about 2x higher when self-heating is removed [3,4]. For monolayer materials, we have used molecular dynamics (MD) to understand their thermal conductivity in the presence of a substrate, finding that it is always lower than that of a suspended film [5,6]. For multilayer materials, our experiments have found evidence of very long cross-plane phonon mean free paths, ~200 nm at room temperature in MoS2 [7]. Cross-plane heat flow of MoS2 can be tuned in real time by the reversible intercalation of Li, creating the equivalent of a thermal transistor [8]. We have also realized extremely good thermal insulators by layering heterogeneous monolayers (e.g. graphene, MoSe2, WSe2, MoS2), achieving effective cross-plane thermal conductivities approximately 3-times lower than air [9]. A similar concept can be used with layered superlattices as the active material in phase change memory, enabling ultralow power operation [10]. I will also describe how some of our findings apply to electronic systems, where anisotropic materials like h-BN could play a role as heat spreaders [11]. These results broaden our understanding of heat flow in layered materials, and help us explore their applications for thermal management in electronics.

Bio

Eric Pop Prof. Eric Pop is the Pease-Ye Professor of Electrical Engineering (EE) and Materials Science & Engineering (by courtesy) at Stanford, where he leads the SystemX Heterogeneous Integration focus area. His research interests include nanoelectronics, data storage, and energy. Before Stanford, he spent several years on the faculty of UIUC, and in industry at Intel and IBM. He received his PhD in EE from Stanford (2005) and three degrees from MIT in EE and Physics. His honors include the Intel Outstanding Researcher Award, the PECASE from the White House, and Young Investigator Awards from the Navy, Air Force, DARPA, and NSF CAREER. He is an APS and IEEE Fellow, an Editor of 2D Materials, and a Clarivate Highly Cited Researcher. In his spare time he enjoys snowboarding and tennis, and in a past life he was a college radio DJ at KZSU 90.1. More information about the Pop Lab is available at http://poplab.stanford.edu and on Twitter @profericpop.

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References

  1. E. Yalon et al., Nano Lett. 17, 3429 (2017)
  2. S. Islam et al., IEEE EDL 34, 166 (2013)
  3. K. Smithe et al., Nano Lett. 18, 4516 (2018)
  4. J. Nathawat et al., Phys. Rev. Mater. 4, 014002 (2020)
  5. A. Gabourie et al., 2D Mater. 8, 011001 (2021)
  6. A. Gabourie et al., J. Appl. Phys. 131, 195103 (2022)
  7. A. Sood et al., Nano Lett. 19, 2434 (2019)
  8. A. Sood et al., Nature Comm. 9, 4510 (2018)
  9. S. Vaziri et al., Science Adv. 5, eaax1325 (2019)
  10. A. Khan et al., Science 373, 1243 (2021)
  11. C. Koroglu & E. Pop, IEEE EDL 44, 496 (2023)

Cite this work

Researchers should cite this work as follows:

  • Eric Pop (2024), "Thermal Transport in Layered Materials, Devices, and Systems," https://nanohub.org/resources/38829.

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Time

Location

234 Potter, Purdue University, West Lafayette, IN

Tags

Thermal Transport in Layered Materials, Devices, and Systems
  • Thermal Transport in Layered Materials, Devices, and Systems 1. Thermal Transport in Layered M… 0
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  • Stanford Univ. 2. Stanford Univ. 154.05405405405406
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  • Outline 3. Outline 205.00500500500502
    00:00/00:00
  • Electronics Use (and Waste) Much Power 4. Electronics Use (and Waste) Mu… 224.19085752419087
    00:00/00:00
  • Electronics Use (and Waste) Much Power 5. Electronics Use (and Waste) Mu… 266.16616616616619
    00:00/00:00
  • Electronics Use (and Waste) Much Power 6. Electronics Use (and Waste) Mu… 289.82315648982319
    00:00/00:00
  • Electronics Use (and Waste) Much Power 7. Electronics Use (and Waste) Mu… 425.22522522522524
    00:00/00:00
  • Moore's Law 8. Moore's Law 470.80413747080416
    00:00/00:00
  • Moore's Law vs. Dennard's Law 9. Moore's Law vs. Dennard's Law 565.63229896563234
    00:00/00:00
  • The Problem with Computing Today 10. The Problem with Computing Tod… 693.22655989322664
    00:00/00:00
  • 3D Is Driving our 2D and Thermal Work 11. 3D Is Driving our 2D and Therm… 828.59526192859528
    00:00/00:00
  • Historical Sidenote: 3D at Stanford in 1982 12. Historical Sidenote: 3D at Sta… 1008.5752419085753
    00:00/00:00
  • In 3D, Thermal Properties Are Very Important 13. In 3D, Thermal Properties Are … 1142.7093760427094
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  • Outline 14. Outline 1207.8078078078079
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  • What Are 2-Dimensional (2D) Materials? 15. What Are 2-Dimensional (2D) Ma… 1210.643977310644
    00:00/00:00
  • Ex: Electron & Phonon Bands of 2D MoS2 16. Ex: Electron & Phonon Bands of… 1264.1975308641977
    00:00/00:00
  • Huge Advances in 2D Synthesis 17. Huge Advances in 2D Synthesis 1319.1524858191526
    00:00/00:00
  • Thermal Properties of 2D Materials 18. Thermal Properties of 2D Mater… 1386.0527193860528
    00:00/00:00
  • Thermal κ of MoS2 on SiO2 Decreases 19. Thermal κ of MoS2 on SiO2 Dec… 1443.0430430430431
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  • Thermal κ of MoS2 on Other Substrates 20. Thermal κ of MoS2 on Other Su… 1582.0487153820488
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  • Cross-Plane Thermal κz of MoS2 21. Cross-Plane Thermal κz of MoS… 1687.3206539873206
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  • Cross-Plane Thermal κz of MoS2 22. Cross-Plane Thermal κz of MoS… 1775.8091424758093
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  • Outline 23. Outline 1849.5495495495495
    00:00/00:00
  • Wanted: 2D Transistors for 3D Integration 24. Wanted: 2D Transistors for 3D … 1851.4514514514515
    00:00/00:00
  • Energy Dissipation in MoS2 Transistors 25. Energy Dissipation in MoS2 Tra… 1948.4150817484151
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  • Where Does the Heat Go in Transistors? 26. Where Does the Heat Go in Tran… 2072.0720720720719
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  • Can Pulsing Eliminate Self-Heating? 27. Can Pulsing Eliminate Self-Hea… 2202.6026026026025
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  • Very Large Cross-Plane Thermal Resistance 28. Very Large Cross-Plane Thermal… 2316.4831498164831
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  • Unusual Application: Thermal Transistor #1 29. Unusual Application: Thermal T… 2397.1971971971975
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  • Unusual Application: Thermal Transistor #2 30. Unusual Application: Thermal T… 2460.4938271604938
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  • Applications to Phase-Change Memory 31. Applications to Phase-Change M… 2541.0076743410077
    00:00/00:00
  • Exploiting Graphene, MoS2 As Thermal Barrier 32. Exploiting Graphene, MoS2 As T… 2626.8935602268934
    00:00/00:00
  • Layered Superlattice Phase-Change Memory 33. Layered Superlattice Phase-Cha… 2705.5722389055722
    00:00/00:00
  • Thermal Challenges in 3D Systems 34. Thermal Challenges in 3D Syste… 2917.3506840173509
    00:00/00:00
  • Thermal Measurements in Our Group 35. Thermal Measurements in Our Gr… 3039.6730063396731
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  • Summary 36. Summary 3097.997997997998
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  • Acknowledgements 37. Acknowledgements 3178.2449115782451
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