Courses
MEST Introduction to Integrated Circuit Packaging and Assembly
This course introduces students to the world of integrated circuit (IC) packaging and assembly including consideration of the impact of packaging on system performance and reliability.
This course introduces students to the world of integrated circuit (IC) packaging and assembly including consideration of the impact of packaging on system performance and reliability.
Key topics:
- ICs and their physical interfaces
- IC connection techniques and properties
- Common IC packages and characteristics
- Advanced IC packaging techniques including 3D stacking and heterogeneous
- integration