Anisotropic Electromigration in Sn-Cu solders

This tool simulates how the microstructure of a Cu-Sn solder evolves during electromigration.

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Version 1.1 - published on 19 May 2023

doi:10.21981/DRFJ-RB54 cite this

Open source: license | download

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Usage

World usage

Location of all "Anisotropic Electromigration in Sn-Cu solders" Users Since Its Posting

Cumulative Simulation Users

19

7 8 11 11 11 12 13 14 14 14 15 19

Simulation Runs

83

20 26 54 58 60 62 66 70 70 70 73 83
Overview
Average Total
Wall Clock Time 2.91 hours 5.69 days
CPU time 3.93 hours 7.69 days
Interaction Time 41.69 minutes 1.36 days