By Andrew Minh Pham1; Kyle Christian DeLay1; Marisol Koslowski1
1. Purdue University
This tool simulates how the microstructure of a Cu-Sn solder evolves during electromigration.
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Version 1.1 - published on 19 May 2023
doi:10.21981/DRFJ-RB54 cite this
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