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Carbon Nanotubes Interconnect Analyzer (CNIA)

This resource has a 8.6 Ranking

Ranking is calculated from a formula comprised of user reviews and usage statistics. Learn more ›

Usage Stats
Overall Period: Updated 04 Dec, 2008
Users: 375
Jobs: 2188
Avg. exec. time: 10 secs
Reviews & Citations
Google/IEEE: updated 22 Apr, 2008
Avg. Review: 5.0 out of 5 stars
Citations: 1

375 users, detailed statistics

1 review (Review this)

1 citation

1 question (Ask a question)

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Available Versions

Version 1.1 - published on 11 Feb, 2008
Contributor(s) Sansiri Tanachutiwat
College of Nanoscale Science and Engineering, University at Albany, Albany, NY, USA

Wei Wang
CNSE, University at Albany
At a glance This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results. The tool was developed by the nanoelectronic research group led by Dr. Wei Wang, College of Nanoscale Science and Engineering, University at Albany. "Analyzing conductance of carbon ...
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Description

This tool estimates the conductance and inductance of carbon nanotube bundles for interconnect applications. The analysis is based on the bundle structure of a mixture of multi-wall and single-wall carbon nanotubes, which is a realistic structure and significantly different from other theoretical results.

Credits

The tool was developed by the nanoelectronic research group led by Dr. Wei Wang, College of Nanoscale Science and Engineering, University at Albany.

References

Cite this work

If you reference this work in a publication, please cite as follows:

  • "Analyzing conductance of carbon nanotube bundles," IEEE Electronic Device Letters, (2007).
  • "Liwei Shang, Ming Liu, Sansiri Tanachutiwat and Wei Wang, “Diameter-dependant thermal conductance models of carbon nanotubes,” International Journal of NanoParticles, CNT special issue,(2007).
  • "Liwei Shang, Ming Liu, Sansiri Haruehanroengra, and Wei Wang, “Inductance of mixed carbon nanotube bundles,” IEE Micro and Nano Letters, vol. 2, no. 2, pp. 35-39, June 2007.
  • Tanachutiwat, Sansiri; Wang, Wei (2007), "Carbon Nanotubes Interconnect Analyzer (CNIA)," doi: 10254/nanohub-r2464.2.

    BibTex | EndNote

In addition, we would appreciate it if you would add the following acknowledgment to your publication:

  • Simulation services for results presented here were provided by the Network for Computational Nanotechnology (NCN) at nanoHUB.org

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  1. 5.0 out of 5 stars 

    Posted on 02 February, 2008 by Anonymous

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