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NEMS Workshop

Thermal Conductance of solid-Solid and Solid-Liquid Interfaces

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Last 12 Months: updated 01 Jun, 2008
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Contributor(s) David G. Cahill
University of Illinois, Urbana-Champaign
Abstract

cahill The thermal conductance of interfaces is a key factor in controlling thermal conduction in nanostructured materials, composites, and individual nanostructures. We have recently advanced the state-of-the-art of time-domain-thermoreflectance (TDTR) measurements of thermal transport and are using TDTR to study heat transport across individual interfaces with extremely high and low thermal conductance; and heat transport in nanoscale W/alumina multilayers that circumvent the lower-limits for homogeneous materials imposed by the minimum thermal conductivity. The 3 �?�m spatial resolution of our TDTR measurements also enables rapid high-resolution imaging of the thermal conductivity of complex microstructures and combinatorial samples. Heat transport in suspension of carbon nanotubes and metal nanoparticles are studied by picosecond transient absorption. Most of the vibrational modes of a carbon nanotube are weakly coupled to their environment; by contrast, the thermal coupling of metal nanoparticles to surrounding water is surprisingly efficient.
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  • Cahill, David G. (2005), "Thermal Conductance of solid-Solid and Solid-Liquid Interfaces," http://www.nanohub.org/resources/113/.

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Date posted 09 May, 2005
Time Friday, April 8, 2005
Location Burton Morgan Entrepreneurship Center, Room 121
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  • 7.6 Ranking Workshops Part of: NEMS Workshop

    NEMS Workshop

    Type Workshops
    Date 28 Dec, 2004
    Avg. Rating 0.0 out of 5 stars  (0)
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    The Network for Computational Nanotechnology (NCN) held a workshop entitled Challenges and Opportunities in the Development of Nanoelectromechanical Systems on April, 8, 2005. The workshop was held at the Entrepreneurship Center at Purdue University and featured presentations and discussion on …

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